SOM-5992 COM Express 3.0 Type 7

• Intel® Xeon® Processor D-1500 Product Family
• COM Express R3.0 Basic Module Type 7 pinout
• 2~16 core processor, with max. TDP 45W
• Dual-CH DDR4 2400 w/ECC, max. 128GB
• High-speed Ethernet (dual 10GBASE-KR interfaces, one GbE)
• Abundant expansion. (PCIe x16, PCIe x8, 8 PCIe x1)

SOM-5992, designed around the Intel® Xeon® Processor D-1500 family, brings the performance and advanced intelligence of Intel® Xeon® processors into a dense, low-power system-on-a-chip. With enhanced reliability, availability, and serviceability features, platform storage extensions, and built-in hardware virtualization, the Intel® Xeon® processor D-1500 product family offers new possibilities for a variety of applications. SOM-5992 is suitable for midrange routers, network appliances, security appliances, wireless base stations, embedded midrange IoT devices, entry networking, midrange storage area networks (SANs), network-attached storage (NAS) appliances, warm cloud storage, and more.

In a breakthrough move, SOM-5992 supports a maximum of 128 GB DDR4 memory which should help fulfill the ever-increasing server application demands in the area of COM Express. The Intel® Xeon® processor D-1500 delivers 16 processor cores and 64 GB memory, combined with computer-on-module flexibility, this is an optimal solution for users who want extreme computing performance and non-stop service. Moreover, the SOM-5992 incorporates two 10GBase-KR interfaces for integrating with 10GbE customer carrier boards. PCIe x16 and 8 PCIe x1 Supports Non-Transparent Bridge (NTB), which allows redundancy via PCIe. This helps reduce data loss, allowing a secondary system to take over PCIe storage device management if a CPU fails, and provides high availability for applications requiring continuous service.

SOM-5992 has four screw holes near the CPU, positioned in compliance with the Intel® standard thermal design guide. The thermal module is attached to the CPU in a balanced torque design, and it is the first COM Express to have an added backplane to increase rigidity like a single board, so the thermal module makes tight contact with the CPU with no board bending. This result is highly efficient heat dissipation with outstanding computing performance. The SOM-5992-thermal solution pre-assembly service that can assist in system-level assembly.

Additional Options

• Flash Memory
• Operating Systems
• PC/104 Modules
• Custom and Semi-custom Engineering Services