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SOM-6896 is a new COM Express (PICMG COM.0) R2.1 Compact Module in a Type
6 pin-out module board. SOM-6896 is equipped with the latest 5th generation Intel®
SOM-5992 COM Express 3.0 Type 7
- SOM-5992 is Not Recommended for New Designs "NRND"
- Last Time buy date 11/30/2022
- Intel® Xeon® Processor D-1500 Product Family
- COM Express R3.0 Basic Module Type 7 pinout
- 2~16 core processor, with max. TDP 45W
- Dual-CH DDR4 2400 w/ECC, max. 128GB
- High-speed Ethernet (dual 10GBASE-KR interfaces, one GbE)
- Abundant expansion. (PCIe x16, PCIe x8, 8 PCIe x1)
32Spi21132 SOM-5992, designed around the Intel® Xeon® Processor D-1500 family, brings the performance and advanced intelligence of Intel® Xeon® processors into a dense, low-power system-on-a-chip. With enhanced reliability, availability, and serviceability features, platform storage extensions, and built-in hardware virtualization, the Intel® Xeon® processor D-1500 product family offers new possibilities for a variety of applications.
Features
- Intel® Xeon® Processor D-1500 Product Family
- COM Express R3.0 Basic Module Type 7 pinout
- 2~16 core processor, with max. TDP 45W
- Dual-CH DDR4 2400 w/ECC, max. 128GB
- High-speed Ethernet (dual 10GBASE-KR interfaces, one GbE)
- Abundant expansion. (PCIe x16, PCIe x8, 8 PCIe x1)
Overview
SOM-5992, designed around the Intel® Xeon® Processor D-1500 family, brings the performance and advanced intelligence of Intel® Xeon® processors into a dense, low-power system-on-a-chip. With enhanced reliability, availability, and serviceability features, platform storage extensions, and built-in hardware virtualization, the Intel® Xeon® processor D-1500 product family offers new possibilities for a variety of applications. SOM-5992 is suitable for midrange routers, network appliances, security appliances, wireless base stations, embedded midrange IoT devices, entry networking, midrange storage area networks (SANs), network-attached storage (NAS) appliances, warm cloud storage, and more.
In a breakthrough move, SOM-5992 supports a maximum of 128 GB DDR4 memory which should help fulfill the ever-increasing server application demands in the area of COM Express. The Intel® Xeon® processor D-1500 delivers 16 processor cores and 64 GB memory, combined with computer-on-module flexibility, this is an optimal solution for users who want extreme computing performance and non-stop service. Moreover, the SOM-5992 incorporates two 10GBase-KR interfaces for integrating with 10GbE customer carrier boards. PCIe x16 and 8 PCIe x1 Supports Non-Transparent Bridge (NTB), which allows redundancy via PCIe. This helps reduce data loss, allowing a secondary system to take over PCIe storage device management if a CPU fails, and provides high availability for applications requiring continuous service.
SOM-5992 has four screw holes near the CPU, positioned in compliance with the Intel® standard thermal design guide. The thermal module is attached to the CPU in a balanced torque design, and it is the first COM Express to have an added backplane to increase rigidity like a single board, so the thermal module makes tight contact with the CPU with no board bending. This result is highly efficient heat dissipation with outstanding computing performance. The SOM-5992-thermal solution pre-assembly service that can assist in system-level assembly.
Specifications
| Processor | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CPU | Intel® Xeon® Processor D-1500 |
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| Clock Speed | 2.7 GHz |
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| Processor Misc. |
|
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| Memory | |
|---|---|
| RAM | up to 128GB DDR4 (4x SODIMM) |
| Memory Misc. | ECC Support: ECC and non-ECC |
| Primary IO | |
|---|---|
| GPIO | 8x GPIO |
| Disk Interface | 2x SATA |
| Ethernet | 2x 10G INTEL LAN controller & Intel I210AT/I210IT 10/100/1000 Mbps |
| USB | 4x USB 3.0 & 4x USB 2.0 |
| Serial Ports | 2x COM (2-Wire) |
| Secondary IO | |
|---|---|
| SPI | Yes for BIOS ROM |
| Expansion | |
|---|---|
| Bus Expansion | COM Express R3.0 Type 7 compatible |
| Bus Misc. | PCI Express x16 1 PCIe x16 Gen.3, and bifurcatable to 2 x8, 1 x8 & 2 x4, or 4 x4 |
| Misc | |
|---|---|
| Operating Systems | EMAC OE Linux, Windows Embedded Standard 2009 / WES09 (Windows XPE ) |
| SOM Type | COM Express Modules |
Mechanical and Environmental
| Dimensions | |
|---|---|
| Size | 4.92" ×3.74" (124mm × 94mm) |
| Power Requirements | |
|---|---|
| Power Misc. | Type ATX: Vin, VSB, AT: Vin |
| Environmental | |
|---|---|
| Low Operating Temperature | 0 C (32 F) |
| High Operating Temperature | 60 C (140 F) |
| Upper Operating Humidity | 95% |
| Environmental Misc. | Operating Standard: 0 ~ 60° C (32 ~ 140° F)
Extend Temp. : -40 ~ 85° C (-40 ~ 185° F) with 0.7m/s air flow
Storage: -40 ~ 85° C (-40 ~ 185° F) |
Pricing
Pricing correct as of January 2021. Please contact EMAC for Current Pricing and Lead Time. Due to volatility in the electronics industry pricing is subject to change.
OEM / Quantity Pricing Available on Request - Less Services
(Single Unit Pricing. Includes: Integration, Setup,Testing, & Enhanced Support)
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